Title :
On-state transient electrothermal modeling of large area power components and multichip power modules
Author :
Bellil, Kais ; Tounsi, Patrick ; Dorke, Jean-Marie
Author_Institution :
CNRS, Toulouse, France
Abstract :
This paper presents an original method specifically intended for transient electrothermal simulation of large area power modules. A simple on-state electrical modeling is associated with a heat-flow equation solver, which is able to predict temperature distributions over the whole active area of the module by taking into account transient 3D heat diffusion effects in chips and their common package. The method permits one to predict the electrothermal behavior of large area power components or modules when the waveform of the load current is known and has been implemented in a new software tool
Keywords :
digital simulation; electronic engineering computing; multichip modules; packaging; power electronics; temperature distribution; transients; active area; heat-flow equation solver; large area power components; load current; multichip power modules; on-state transient electrothermal modeling; temperature distributions; transient 3D heat diffusion effects; Circuit simulation; Electronic packaging thermal management; Electrothermal effects; Equations; Multichip modules; Power dissipation; Predictive models; Resistance heating; Temperature dependence; Temperature distribution;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722246
