• DocumentCode
    1831722
  • Title

    Framework for power package design and optimization

  • Author

    Trivedi, Malay ; Shenai, Krishna

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
  • fYear
    1998
  • fDate
    17-19 Sep 1998
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    Optimization of power electronic systems is becoming crucial with the increasing impact of power electronics on efficient utilization of energy. Presently, power devices and systems are being optimized independently, resulting in inefficient systems. It is important to understand the interaction between circuit operation and device behavior in order to develop optimal power systems. Power devices must be designed with adequate consideration of reliability issues, and thermal as well as packaging limitations. A framework is presented for the efficient development of power systems taking device-circuit interactions into account. Presently available simulators can be efficiently utilized to develop such a framework
  • Keywords
    optimisation; packaging; power electronics; reliability; circuit operation; device behavior; device-circuit interactions; optimization; power electronic systems; power package design; reliability issues; thermal limitations; Circuit simulation; Circuit topology; Design optimization; Insulated gate bipolar transistors; Packaging; Power conversion; Power electronics; Power semiconductor devices; Power system reliability; Power system simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-5033-2
  • Type

    conf

  • DOI
    10.1109/IWIPP.1998.722248
  • Filename
    722248