DocumentCode :
1831722
Title :
Framework for power package design and optimization
Author :
Trivedi, Malay ; Shenai, Krishna
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
fYear :
1998
fDate :
17-19 Sep 1998
Firstpage :
35
Lastpage :
38
Abstract :
Optimization of power electronic systems is becoming crucial with the increasing impact of power electronics on efficient utilization of energy. Presently, power devices and systems are being optimized independently, resulting in inefficient systems. It is important to understand the interaction between circuit operation and device behavior in order to develop optimal power systems. Power devices must be designed with adequate consideration of reliability issues, and thermal as well as packaging limitations. A framework is presented for the efficient development of power systems taking device-circuit interactions into account. Presently available simulators can be efficiently utilized to develop such a framework
Keywords :
optimisation; packaging; power electronics; reliability; circuit operation; device behavior; device-circuit interactions; optimization; power electronic systems; power package design; reliability issues; thermal limitations; Circuit simulation; Circuit topology; Design optimization; Insulated gate bipolar transistors; Packaging; Power conversion; Power electronics; Power semiconductor devices; Power system reliability; Power system simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
Type :
conf
DOI :
10.1109/IWIPP.1998.722248
Filename :
722248
Link To Document :
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