DocumentCode
1831722
Title
Framework for power package design and optimization
Author
Trivedi, Malay ; Shenai, Krishna
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Illinois Univ., Chicago, IL, USA
fYear
1998
fDate
17-19 Sep 1998
Firstpage
35
Lastpage
38
Abstract
Optimization of power electronic systems is becoming crucial with the increasing impact of power electronics on efficient utilization of energy. Presently, power devices and systems are being optimized independently, resulting in inefficient systems. It is important to understand the interaction between circuit operation and device behavior in order to develop optimal power systems. Power devices must be designed with adequate consideration of reliability issues, and thermal as well as packaging limitations. A framework is presented for the efficient development of power systems taking device-circuit interactions into account. Presently available simulators can be efficiently utilized to develop such a framework
Keywords
optimisation; packaging; power electronics; reliability; circuit operation; device behavior; device-circuit interactions; optimization; power electronic systems; power package design; reliability issues; thermal limitations; Circuit simulation; Circuit topology; Design optimization; Insulated gate bipolar transistors; Packaging; Power conversion; Power electronics; Power semiconductor devices; Power system reliability; Power system simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-5033-2
Type
conf
DOI
10.1109/IWIPP.1998.722248
Filename
722248
Link To Document