Title :
Integrated magnetic-semiconductor components
Author :
Lotfi, Ashraf ; Weld, John
Author_Institution :
AT&T Bell Labs., Murray Hill, NJ, USA
Abstract :
We have taken a component view of packaging techniques to achieve high density, low profile power converters. In this work, we have focused on the simultaneous z-axis mounting and plastic encapsulation of the power magnetic device and the power semiconductors into one integrated package. In this effort we study the impact on power density, electrical and thermal performance as well as manufacturability
Keywords :
encapsulation; plastic packaging; power convertors; power semiconductor devices; thermal analysis; electrical performance; low profile power converters; manufacturability; packaging techniques; plastic encapsulation; power density; power magnetic device; power semiconductors; thermal performance; z-axis mounting; Chip scale packaging; Copper; Encapsulation; Lead; Magnetic devices; Pins; Plastic packaging; Semiconductor device manufacture; Semiconductor device packaging; Windings;
Conference_Titel :
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-5033-2
DOI :
10.1109/IWIPP.1998.722249
