Title :
Methodology for screening high performance underfill materials
Author :
Hoang, L. ; Murphy, A. ; Desai, K.
Author_Institution :
LSI Logic Corp., Fremont, CA, USA
Abstract :
This paper discusses screening methodologies to test for processability and reliability of underfill materials. The processability of underfills can be determined by flow studies at different temperatures. The larger process window points to a more robust material. In addition, a shear test method was developed for measuring the strengths of assembled parts following moisture soaking conditions. Confirmation builds subjected to JEDEC preconditioning level 3 and 4 yield good correlation with the results from the screening methodology
Keywords :
adhesion; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; moisture; JEDEC preconditioning; flip chip devices; flow studies; moisture soaking conditions; processability; reliability; screening methodologies; shear test method; underfill materials; Fatigue; Flip chip; Logic testing; Material properties; Materials reliability; Materials testing; Moisture; Silicon; Soldering; Temperature;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678679
