• DocumentCode
    1831871
  • Title

    EM radiation from interconnected surface-microstrip line structures by a coaxial cable

  • Author

    Kayano, Yoshiki ; Inoue, Hiroshi

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Akita Univ., Akita, Japan
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    51
  • Lastpage
    56
  • Abstract
    In recent years, effective methods for predicting and suppressing EMI over a broad band are required. In this paper, we focus on an equivalent circuit model for predicting EM radiation from a surface-microstrip line (S-MSL) structure with an interconnection coaxial cable. Firstly, frequency responses of common-mode (CM) current on the interconnection coaxial cable and EM radiation are studied experimentally and compared with FDTD modeling. It was demonstrated that the ground plane of the interconnected PCBs and the interconnection cable are the dominant radiation factor at low frequencies. Secondly, an equivalent circuit model for predicting CM current in the ground-connection model was proposed. The equivalent circuit model is based on consideration of concepts of CM antenna impedance to current- and voltage-driven mechanisms. Its validity was discussed by comparing FDTD simulation results. The good agreement between the predicted and measured results indicates the validity of the equivalent circuit model.
  • Keywords
    coaxial cables; equivalent circuits; CM antenna impedance; FDTD modeling; FDTD simulation; common-mode current; dominant radiation factor; electromagnetic radiation; equivalent circuit model; frequency response; ground-connection model; interconnected PCB; interconnection coaxial cable; surface-microstrip line structure; Coaxial cables; Electromagnetic interference; Electromagnetic radiation; Equivalent circuits; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Predictive models; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284556
  • Filename
    5284556