DocumentCode
1832445
Title
Improvements and recent advances in nanocomposite capacitors using a colloidal technique
Author
Agarwal, Vishal ; Chahal, Premjeet ; Tummala, Rao R. ; Allen, Mark G.
Author_Institution
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
165
Lastpage
170
Abstract
In this work, a colloidal technique is used to improve the dielectric properties of nanocomposite materials and to achieve thin film deposition (<5 μm) on large area substrates using meniscus coating. Using this technique, improved particle dispersion is achieved, which in turn allows for higher volume loading (increased dielectric constant), small variation of dielectric constant across the substrate, and thin-film deposition with lower particle-induced defects. Appropriate dispersants and fillers particularly applicable to meniscus coating of these composite materials were found which allowed the coated and cured composite material to attain high relative dielectric constant (typical 40). Non-meniscus-coated samples with dielectric constants as high as 74 were achieved by varying the particle size distribution
Keywords
coating techniques; colloids; multichip modules; particle reinforced composites; permittivity; thin film capacitors; MCM; colloidal technique; dielectric constant; dielectric properties; dispersants; fillers; meniscus coating; nanocomposite capacitors; particle dispersion; particle size distribution; particle-induced defects; Capacitors; Coatings; Composite materials; Dielectric constant; Dielectric substrates; Dielectric thin films; High-K gate dielectrics; Nanocomposites; Nanostructured materials; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678687
Filename
678687
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