• DocumentCode
    1832445
  • Title

    Improvements and recent advances in nanocomposite capacitors using a colloidal technique

  • Author

    Agarwal, Vishal ; Chahal, Premjeet ; Tummala, Rao R. ; Allen, Mark G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    165
  • Lastpage
    170
  • Abstract
    In this work, a colloidal technique is used to improve the dielectric properties of nanocomposite materials and to achieve thin film deposition (<5 μm) on large area substrates using meniscus coating. Using this technique, improved particle dispersion is achieved, which in turn allows for higher volume loading (increased dielectric constant), small variation of dielectric constant across the substrate, and thin-film deposition with lower particle-induced defects. Appropriate dispersants and fillers particularly applicable to meniscus coating of these composite materials were found which allowed the coated and cured composite material to attain high relative dielectric constant (typical 40). Non-meniscus-coated samples with dielectric constants as high as 74 were achieved by varying the particle size distribution
  • Keywords
    coating techniques; colloids; multichip modules; particle reinforced composites; permittivity; thin film capacitors; MCM; colloidal technique; dielectric constant; dielectric properties; dispersants; fillers; meniscus coating; nanocomposite capacitors; particle dispersion; particle size distribution; particle-induced defects; Capacitors; Coatings; Composite materials; Dielectric constant; Dielectric substrates; Dielectric thin films; High-K gate dielectrics; Nanocomposites; Nanostructured materials; Sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components &amp; Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678687
  • Filename
    678687