DocumentCode
1832830
Title
A high-speed lossless embedded compression codec for high-end LCD applications
Author
Lee, Yu-Hsuan ; Lee, Yu-Yu ; Lin, Huang-Zueng ; Tsai, Tsung-Han
Author_Institution
DSP/VLSI Lab. Dept. of Electron. Eng., Nat. Central Univ., Jhongli
fYear
2008
fDate
3-5 Nov. 2008
Firstpage
185
Lastpage
188
Abstract
Due to the great evolution of LCD panel technology, the memory bandwidth of display media system is significantly increased. Its impact on system cost, EMI of transmission interface, and memory bandwidth almost dominates the performance of entire display media system. To eliminate this effect, a high-speed lossless embedded compression algorithm with pipelining and parallel VLSI architecture is proposed. With associated geometric-based probability model (AGPM), the compact coding flow is constructed by geometric-based binary code and content-adaptive Golomb-Rice code to achieve high-speed capability. The entire codec is implemented by TSMC 0.18-mum 1P6M CMOS technology with Artisan cell library. The processing capability of two-level parallelism achieves Full-HD 1080p@60 Hz with RGB components, and the four-level parallelism can further support 120 Hz double frame rate (DFR) technique for high-end LCD applications.
Keywords
CMOS integrated circuits; VLSI; adaptive codes; binary codes; codecs; geometric codes; liquid crystal displays; probability; Artisan cell library; EMI; LCD panel; RGB components; TSMC 1P6M CMOS technology; associated geometric-based probability model; content- adaptive Golomb-Rice code; display media system; double frame rate technique; geometric-based binary code; high-end LCD; high-speed lossless embedded compression codec; memory bandwidth; parallel VLSI architecture; pipelining VLSI architecture; transmission interface; two-level parallelism achieves Full-HD; Bandwidth; CMOS technology; Codecs; Compression algorithms; Costs; Electromagnetic interference; Liquid crystal displays; Pipeline processing; Semiconductor device modeling; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
Conference_Location
Fukuoka
Print_ISBN
978-1-4244-2604-1
Electronic_ISBN
978-1-4244-2605-8
Type
conf
DOI
10.1109/ASSCC.2008.4708759
Filename
4708759
Link To Document