• DocumentCode
    1832830
  • Title

    A high-speed lossless embedded compression codec for high-end LCD applications

  • Author

    Lee, Yu-Hsuan ; Lee, Yu-Yu ; Lin, Huang-Zueng ; Tsai, Tsung-Han

  • Author_Institution
    DSP/VLSI Lab. Dept. of Electron. Eng., Nat. Central Univ., Jhongli
  • fYear
    2008
  • fDate
    3-5 Nov. 2008
  • Firstpage
    185
  • Lastpage
    188
  • Abstract
    Due to the great evolution of LCD panel technology, the memory bandwidth of display media system is significantly increased. Its impact on system cost, EMI of transmission interface, and memory bandwidth almost dominates the performance of entire display media system. To eliminate this effect, a high-speed lossless embedded compression algorithm with pipelining and parallel VLSI architecture is proposed. With associated geometric-based probability model (AGPM), the compact coding flow is constructed by geometric-based binary code and content-adaptive Golomb-Rice code to achieve high-speed capability. The entire codec is implemented by TSMC 0.18-mum 1P6M CMOS technology with Artisan cell library. The processing capability of two-level parallelism achieves Full-HD 1080p@60 Hz with RGB components, and the four-level parallelism can further support 120 Hz double frame rate (DFR) technique for high-end LCD applications.
  • Keywords
    CMOS integrated circuits; VLSI; adaptive codes; binary codes; codecs; geometric codes; liquid crystal displays; probability; Artisan cell library; EMI; LCD panel; RGB components; TSMC 1P6M CMOS technology; associated geometric-based probability model; content- adaptive Golomb-Rice code; display media system; double frame rate technique; geometric-based binary code; high-end LCD; high-speed lossless embedded compression codec; memory bandwidth; parallel VLSI architecture; pipelining VLSI architecture; transmission interface; two-level parallelism achieves Full-HD; Bandwidth; CMOS technology; Codecs; Compression algorithms; Costs; Electromagnetic interference; Liquid crystal displays; Pipeline processing; Semiconductor device modeling; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
  • Conference_Location
    Fukuoka
  • Print_ISBN
    978-1-4244-2604-1
  • Electronic_ISBN
    978-1-4244-2605-8
  • Type

    conf

  • DOI
    10.1109/ASSCC.2008.4708759
  • Filename
    4708759