• DocumentCode
    1833212
  • Title

    Automated RF/DC Testing of Microwave Device Wafers

  • Author

    Ziegner, Bernhard

  • Author_Institution
    M/A-COM ADVANCED SEMICONDUCTOR OPERATIONS, 100 CHELMSFORD STREET, LOWELL, MA 01851, TELEPHONE: (617) 937-2885
  • Volume
    11
  • fYear
    1987
  • fDate
    31929
  • Firstpage
    174
  • Lastpage
    181
  • Abstract
    An automated wafer level RF/DC test system useful to frequency above 20 GHz has been developed to characterize and determine acceptability of microwave semiconductor die prior to dicing the wafer. This concept has been implemented by the integration of a programmable wafer prober with both an automated DC and RF automatic network analyzer. The entire measurement is under computer control.
  • Keywords
    Automatic testing; Electromagnetic heating; Gallium arsenide; Microwave devices; Power measurement; Radio frequency; Semiconductor device testing; Semiconductor devices; System testing; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 29th
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1987.323863
  • Filename
    4119421
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1833212