• DocumentCode
    1833554
  • Title

    Size reduction of Rectangular Microstrip Patch Antenna incorporated with “INTERCONNECTED FRAMED SHAPED” Metamaterial structure for WLAN applications

  • Author

    Garg, Bimal ; Sharma, Vijay ; Agrawal, Nitin

  • Author_Institution
    Dept. of Electron. Eng., Madhav Inst. of Technol. & Sci., Gwalior, India
  • fYear
    2012
  • fDate
    1-2 March 2012
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This work deals with the analysis and simulation of a Rectangular Patch Antenna supported by a “INTERCONNECTED FRAMED SHAPED” Metamaterial structure at a height of 3.2mm from the ground plane and also investigates the potential properties of the proposed antenna. The proposed Antenna is designed at a operating resonant frequency of 4.65GHz to meet WLAN applications. All the simulation work is done using CST-MWS (Computer Simulation Technology Software). MathCAD-15 Software is used to prove that the proposed design possesses Double-Negative Metamaterial properties. By incorporating the proposed design with the patch antenna at a height of 3.2mm from the ground plane, the patch antenna size is found to be reduced by 30% (area wise). The potential properties like returnloss & bandwidth of the proposed antenna increases to a great extent in comparision to the Rectangular Patch Antenna alone.
  • Keywords
    mathematics computing; metamaterials; microstrip antennas; wireless LAN; CST-MWS; MathCAD-15 software; WLAN; computer simulation technology software; double-negative metamaterial properties; frequency 4.65 GHz; interconnected framed shaped; metamaterial structure; rectangular microstrip patch antenna; size 3.2 mm; Metamaterials; Microstrip; Microstrip antennas; Patch antennas; Permeability; Permittivity; Double-Negative; Interconnected Framed shaped; Metamaterial; Rectangular Microstrip Patch Antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical, Electronics and Computer Science (SCEECS), 2012 IEEE Students' Conference on
  • Conference_Location
    Bhopal
  • Print_ISBN
    978-1-4673-1516-6
  • Type

    conf

  • DOI
    10.1109/SCEECS.2012.6184798
  • Filename
    6184798