Title :
A closed-loop power control function for bio-implantable devices
Author :
Kiyoyama, Kouji ; Tanaka, Yoshito ; Onoda, Mashahiro ; Fukushima, Takafumi ; Tanaka, Tetsu ; Koyanagi, Mitsumasa
Author_Institution :
Dept. of Micro/Nano-Machining Res. & Educ. Center, Tohoku Univ., Sendai
Abstract :
A wireless communication system with a closed-loop power control function for bio-implantable applications is described which keeps the power dissipation of implantable unit at the allowable level for human body. The function is controlled by monitoring an excessive current at the implantable unit and limiting the power transmission at the external interrogator unit. The implantable unit with the closed-loop power control function has been fabricated in a standard 0.18 mum CMOS technology, achieved less than 530 muW with a 1.8 V and the chip core size of 0.14 mm2. The system uses inductive coupling at 13.56 MHz with internal and external coils. Experimental results confirm its stable power supply to the implantable unit over a coil distance of 0.5 to 10 mm.
Keywords :
CMOS integrated circuits; biomedical electronics; closed loop systems; coils; medical control systems; power transmission control; prosthetics; CMOS technology; bioimplantable devices; chip core size; closed-loop power control function; coil distance; distance 0.5 mm to 10 mm; excessive current monitoring; external coils; frequency 13.56 MHz; inductive coupling; internal coils; power dissipation; power supply; power transmission; size 0.18 mum; voltage 1.8 V; wireless communication system; wireless power transmission; CMOS technology; Coils; Communication system control; Humans; Monitoring; Power control; Power dissipation; Power supplies; Power transmission; Wireless communication; Biomedical circuit; CMOS; battery-less; biomedical inductive coupling; body-implantable devices; closed-loop power control; cortical monitoring; mixed-signal; wireless interface; wireless power transmission;
Conference_Titel :
Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
Conference_Location :
Fukuoka
Print_ISBN :
978-1-4244-2604-1
Electronic_ISBN :
978-1-4244-2605-8
DOI :
10.1109/ASSCC.2008.4708793