• DocumentCode
    1833641
  • Title

    Analysis of coupling characteristics between transmission lines with a buried meshed-ground in LTCC-MCMs

  • Author

    Jun-Goo Kim ; Eun-Tae Lee ; Dong-Hoon Kim ; Jong-Hun Lee ; Sun-Young Lee ; Hyeong-Seok Kim ; Jun-Seok Park ; Chang-Yul Cheon

  • Author_Institution
    Wavics Co. Ltd., Seoul, South Korea
  • Volume
    2
  • fYear
    2002
  • fDate
    2-7 June 2002
  • Firstpage
    825
  • Abstract
    Since the manufacturing process does not allow solid ground planes between ceramic layers to isolate the signal lines, the buried ground should be realized as a meshed ground plane. Both characteristic impedances of the signal lines and couplings between different signal layers are influenced by the properties of these meshed planes. In this paper, we propose a new analysis method for coupling behavior between internal transmission lines, which are isolated by the buried meshed-ground planes. The coupling behavior between layers isolated by meshed-ground plane is investigated by the coupled-transmission lines model for the isolated layers. The coupling factors between isolated lines with the meshed-ground are extracted by 2-D FEM calculations.
  • Keywords
    ceramic packaging; coupled transmission lines; finite element analysis; multichip modules; FEM calculations; LTCC-MCMs; analysis method; buried meshed-ground; characteristic impedances; coupled-transmission lines model; coupling characteristics; internal transmission lines; isolated layers; Application software; Ceramics; Conducting materials; Coupling circuits; Fabrication; Impedance; Nonhomogeneous media; Signal analysis; Signal processing; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2002 IEEE MTT-S International
  • Conference_Location
    Seattle, WA, USA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-7239-5
  • Type

    conf

  • DOI
    10.1109/MWSYM.2002.1011758
  • Filename
    1011758