DocumentCode :
1833641
Title :
Analysis of coupling characteristics between transmission lines with a buried meshed-ground in LTCC-MCMs
Author :
Jun-Goo Kim ; Eun-Tae Lee ; Dong-Hoon Kim ; Jong-Hun Lee ; Sun-Young Lee ; Hyeong-Seok Kim ; Jun-Seok Park ; Chang-Yul Cheon
Author_Institution :
Wavics Co. Ltd., Seoul, South Korea
Volume :
2
fYear :
2002
fDate :
2-7 June 2002
Firstpage :
825
Abstract :
Since the manufacturing process does not allow solid ground planes between ceramic layers to isolate the signal lines, the buried ground should be realized as a meshed ground plane. Both characteristic impedances of the signal lines and couplings between different signal layers are influenced by the properties of these meshed planes. In this paper, we propose a new analysis method for coupling behavior between internal transmission lines, which are isolated by the buried meshed-ground planes. The coupling behavior between layers isolated by meshed-ground plane is investigated by the coupled-transmission lines model for the isolated layers. The coupling factors between isolated lines with the meshed-ground are extracted by 2-D FEM calculations.
Keywords :
ceramic packaging; coupled transmission lines; finite element analysis; multichip modules; FEM calculations; LTCC-MCMs; analysis method; buried meshed-ground; characteristic impedances; coupled-transmission lines model; coupling characteristics; internal transmission lines; isolated layers; Application software; Ceramics; Conducting materials; Coupling circuits; Fabrication; Impedance; Nonhomogeneous media; Signal analysis; Signal processing; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-7239-5
Type :
conf
DOI :
10.1109/MWSYM.2002.1011758
Filename :
1011758
Link To Document :
بازگشت