Title :
Polymeric optical interconnect for chip-to-chip communication
Author :
DeGroot, Jon V., Jr. ; Glover, Shedric O. ; Dyer, Mark J. ; Bischel, William K.
Author_Institution :
Dow Corning Corp., Midland, MI, USA
Abstract :
An optical interconnect has been produced on FR-4 board. The interconnect consists of photo-defined optical layers coupled to VCSELs and photodetectors via out of plane mirrors. Materials, fabrication methods and test results will be discussed.
Keywords :
integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; micromirrors; optical couplers; optical polymers; optical waveguides; photodetectors; printed circuits; semiconductor lasers; surface emitting lasers; FR4 board; VCSEL; chip-to-chip communication; coupled photo-defined optical layers; fabrication methods; optical materials; out of plane mirrors; photodetectors; polymeric optical interconnect; Mirrors; Optical crosstalk; Optical device fabrication; Optical interconnections; Optical losses; Optical materials; Optical polymers; Optical refraction; Optical variables control; Optical waveguides;
Conference_Titel :
Optical Fiber Communication Conference, 2005. Technical Digest. OFC/NFOEC
Print_ISBN :
1-55752-783-0
DOI :
10.1109/OFC.2005.193089
