Investigation of mixed-mode input impedance of multi-layer differential vias for impedance matching with traces

Author

Wang, Hanfeng ; Cheng, Wheling ; Zhang, Jianmin ; Fisher, John ; Zhu, Lin ; Drewniak, James L. ; Fan, Jun

Author_Institution

UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO, USA

fYear

2009

fDate

17-21 Aug. 2009

Firstpage

203

Lastpage

207

Abstract

In multilayer printed circuit boards (PCBs), vias are commonly used to connect traces on different signal layers. This paper derives the mixed-mode input impedance of differential vias in typical multilayer structures, and proposes to use the input impedance concept to achieve impedance matching at the via and trace connections. Effects of several geometrical parameters on the input impedance of differential vias have also been studied in this paper. This method can be used to optimize via structures in PCB design processes for smooth via-trace transitions.

Keywords

impedance matching; integrated circuit interconnections; printed circuit design; PCB design process; impedance matching; mixed-mode input impedance expressions; multilayer differential vias; multilayer printed circuit board; smooth via-trace transitions; trace connections; Electromagnetic compatibility; Equivalent circuits; Geometry; Impedance matching; Laboratories; Nonhomogeneous media; Printed circuits; Scattering parameters; Solid modeling; Transmission line matrix methods; differential via; impedance matching; mixed-mode input impedance; signal integrity; via-trace transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on

Conference_Location

Austin, TX

Print_ISBN

978-1-4244-4266-9

Electronic_ISBN

978-1-4244-4058-0

Type

conf

DOI

10.1109/ISEMC.2009.5284629

Filename

5284629