DocumentCode :
1833928
Title :
System-on-chip beyond the nanometer wall
Author :
Magarshack, Philippe ; Paulin, Pierre G.
Author_Institution :
Central R & D, STMicroelectronics, Crolles, France
fYear :
2003
fDate :
2-6 June 2003
Firstpage :
419
Lastpage :
424
Abstract :
In this paper, we analyze the emerging trends in the design of complex Systems-on-a-Chip for nanometer-scale semiconductor technologies and their impact on design automation requirements, from the perspective of a broad range SoC supplier. We present our vision of some of the key changes that will emerge in the next five years. This vision is characterized by two major paradigm changes. The first is that SoC design will become divided into four mostly non-overlapping distinct abstraction levels. Very different competences and design automation tools will be needed at each level. The second paradigm change is the emergence of domain-specific S/W programmable SoC platforms consisting of large, heterogeneous sets of embedded processors. These will be complemented by embedded reconfigurable hardware and networks-on-chip. A key enabler for the effective use of these flexible SoC platforms is a high-level parallel programming model supporting automatic specification-to-platform mapping.
Keywords :
embedded systems; integrated circuit design; integrated circuit technology; multiprocessing systems; nanoelectronics; reconfigurable architectures; system-on-chip; abstraction level; automatic specification-to-platform mapping; design automation tools; domain-specific S/W programmable SoC platform; embedded processor; embedded reconfigurable hardware; multiprocessor systems; nanometer-scale semiconductor technology; networks-on-chip; parallel programming model; system-on-chip; Algorithm design and analysis; Costs; Design automation; Field programmable gate arrays; Integrated circuit technology; Manufacturing processes; Permission; Research and development; System-on-a-chip; Time to market;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2003. Proceedings
Print_ISBN :
1-58113-688-9
Type :
conf
DOI :
10.1109/DAC.2003.1219038
Filename :
1219038
Link To Document :
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