Integrated optoelectronics-to-VLSI packaging technology

A generic integrated optoelectronic-to-VLSI packaging technology using silicon substrate and etched silicon optical submount has been developed and demonstrated. The miniature silicon submount that interfaces optical fiber with the optoelectronic component and the silicon substrate containing VLSI circuits is fabricated with double-sided nonplanar photolithography and anisotropic etching techniques. The advantages of this technology are: ability to interface optical information and circuits with VLSI in a single package; precision controlled capacitive, resistive, and inductive loading; minimized distance between optoelectronic components and electronic ICs, and between decoupling capacitors and active circuits; self-aligned fiber insertion; and highly automated manufacturing. These advantages translate to higher functional density and performance at a lower cost than conventional optoelectronic packaging technologies