• DocumentCode
    1834042
  • Title

    Analytical modeling for crosstalk noise induced by process variations among CNT-based interconnects

  • Author

    Sun, Peng ; Luo, Rong

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    103
  • Lastpage
    107
  • Abstract
    In this paper, we propose a statistical model to analyze the crosstalk noise induced by process variations on single-walled carbon nanotube (SWCNT). Our approach is based on a closed-form metric, which simplifies the noise peak voltage of SWCNT buses into a linear function of process variations. The methodology is based on an assumption that if the variational parameters are independent Gaussian variables, then the performance of the interconnect also tends to have a normal-distributed character. The experiment results reveal that while being able to save the long computation time of SPICE-based tools, this approach yields little loss in accuracy. Also, it provides a compound result which covers all potentical cases and provides more information, promising it to be much closer to the truth in real manufacture process. Compared with SPICE-based Monte Carlo simulations, the experiments report the error in mean and standard deviation of noise peak to be 1.8% and 4.6%, respectively.
  • Keywords
    Monte Carlo methods; SPICE; carbon nanotubes; crosstalk; field buses; integrated circuit interconnections; nanotube devices; statistical analysis; timing; C; Monte Carlo simulations; SPICE; analytical modeling; closed-form metric; crosstalk noise; independent Gaussian variables; interconnects; single-walled carbon nanotube; statistical model; timing analysis; Analytical models; Carbon nanotubes; Conductivity; Contact resistance; Copper; Crosstalk; Electromigration; Integrated circuit interconnections; Manufacturing processes; SPICE;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284643
  • Filename
    5284643