DocumentCode
1834042
Title
Analytical modeling for crosstalk noise induced by process variations among CNT-based interconnects
Author
Sun, Peng ; Luo, Rong
Author_Institution
Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
fYear
2009
fDate
17-21 Aug. 2009
Firstpage
103
Lastpage
107
Abstract
In this paper, we propose a statistical model to analyze the crosstalk noise induced by process variations on single-walled carbon nanotube (SWCNT). Our approach is based on a closed-form metric, which simplifies the noise peak voltage of SWCNT buses into a linear function of process variations. The methodology is based on an assumption that if the variational parameters are independent Gaussian variables, then the performance of the interconnect also tends to have a normal-distributed character. The experiment results reveal that while being able to save the long computation time of SPICE-based tools, this approach yields little loss in accuracy. Also, it provides a compound result which covers all potentical cases and provides more information, promising it to be much closer to the truth in real manufacture process. Compared with SPICE-based Monte Carlo simulations, the experiments report the error in mean and standard deviation of noise peak to be 1.8% and 4.6%, respectively.
Keywords
Monte Carlo methods; SPICE; carbon nanotubes; crosstalk; field buses; integrated circuit interconnections; nanotube devices; statistical analysis; timing; C; Monte Carlo simulations; SPICE; analytical modeling; closed-form metric; crosstalk noise; independent Gaussian variables; interconnects; single-walled carbon nanotube; statistical model; timing analysis; Analytical models; Carbon nanotubes; Conductivity; Contact resistance; Copper; Crosstalk; Electromigration; Integrated circuit interconnections; Manufacturing processes; SPICE;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4266-9
Electronic_ISBN
978-1-4244-4058-0
Type
conf
DOI
10.1109/ISEMC.2009.5284643
Filename
5284643
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