Title : 
Improved technique for extracting parameters of low-loss dielectrics on printed circuit boards
         
        
            Author : 
Koul, Amendra ; Anmula, Praveen K R ; Koledintseva, Marina Y. ; Drewniak, James L. ; Hinaga, Scott
         
        
            Author_Institution : 
Electr. & Comput. Eng. Dept., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
         
        
        
        
        
        
            Abstract : 
The paper is devoted to a methodology and an improved technique of characterization of low-loss dielectrics on printed circuit boards. The technique is based on measuring S-parameters and recalculating them into complex propagation constant. Phase correction is proposed to assure that the phase constant passes through zero at zero frequency. An effect of dielectric loss upon a dielectric constant is considered in the analytical model for dielectric parameter extraction. Dielectric and conductor losses are separated using a model, which includes surface roughness of conductors. Network asymmetry is taken into account in the model. Extracted parameters for frequency-dispersive dielectrics satisfy Kramers-Kroumlnig causality relations. The proposed model allows for extracting dielectric constant and dissipation factor with an increased accuracy.
         
        
            Keywords : 
Kramers-Kronig relations; S-parameters; causality; conductors (electric); dielectric losses; network analysis; permittivity; printed circuit testing; surface roughness; Kramers-Kroumlnig causality relations; S-parameters; complex propagation constant; conductor losses; dielectric constant; dielectric loss; dissipation factor; frequency-dispersive dielectrics; low-loss dielectrics; network asymmetry; parameter extraction; phase constant; phase correction; printed circuit boards; surface roughness; Analytical models; Conductors; Dielectric constant; Dielectric losses; Dielectric measurements; Frequency; Parameter extraction; Printed circuits; Propagation constant; Scattering parameters;
         
        
        
        
            Conference_Titel : 
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
         
        
            Conference_Location : 
Austin, TX
         
        
            Print_ISBN : 
978-1-4244-4266-9
         
        
            Electronic_ISBN : 
978-1-4244-4058-0
         
        
        
            DOI : 
10.1109/ISEMC.2009.5284646