DocumentCode
1834449
Title
Notice of Retraction
Analysis of a monometallic two arm horizontal thermal actuator for MEMS
Author
Patowari, P.K. ; Bharali, A.S. ; Nath, M.M. ; Gogoi, J. ; Singh, C.K. ; Baishya, S.
Author_Institution
Dept. of Mech. Eng., Nat. Inst. of Technol., Silchar, India
Volume
1
fYear
2010
fDate
1-3 Aug. 2010
Abstract
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This paper presents Finite Element Analysis of a horizontal monometallic thermal actuator for MEMS application with three different materials namely Single Crystal Silicon, Poly-Silicon and Titanium. It is aimed to predict the suitability of the three materials for the actuator. Using the software COMSOL™ Multiphysics 3.5, deflection, stress and temperature analyses are carried out, for a range of applied voltages within 8V. Two sets of boundary conditions are considered in this work. In the first case all the boundary conditions are set as having conductive heat flux and in the second case the micro air gap between the two arms of the actuator is considered as an insulating layer. By employing these two cases, a comparison study is presented. It is seen that Titanium and Single Crystal Silicon has high temperature generation and less deflection respectively for the range of applied voltages, but for moderate deflection and temperature generation Poly-Silicon is better than the other two.
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This paper presents Finite Element Analysis of a horizontal monometallic thermal actuator for MEMS application with three different materials namely Single Crystal Silicon, Poly-Silicon and Titanium. It is aimed to predict the suitability of the three materials for the actuator. Using the software COMSOL™ Multiphysics 3.5, deflection, stress and temperature analyses are carried out, for a range of applied voltages within 8V. Two sets of boundary conditions are considered in this work. In the first case all the boundary conditions are set as having conductive heat flux and in the second case the micro air gap between the two arms of the actuator is considered as an insulating layer. By employing these two cases, a comparison study is presented. It is seen that Titanium and Single Crystal Silicon has high temperature generation and less deflection respectively for the range of applied voltages, but for moderate deflection and temperature generation Poly-Silicon is better than the other two.
Keywords
air gaps; elemental semiconductors; finite element analysis; microactuators; silicon; thermal analysis; titanium; MEMS; Si; Ti; conductive heat flux; finite element analysis; insulating layer; microair gap; monometallic two arm horizontal thermal actuator analysis; single crystal silicon; software COMSOLMultiphysics 3.5; temperature analyses; temperature generation polysilicon; voltage 8 V; Crystals; Heating; Integrated circuits; Micromechanical devices; Silicon; Stress; COMSOL Multiphysics; FEA; MEMS; monometallic; thermal actuator;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
Conference_Location
Kyoto
Print_ISBN
978-1-4244-7479-0
Type
conf
DOI
10.1109/ICMEE.2010.5558570
Filename
5558570
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