DocumentCode
1834716
Title
Digitally assisted analog and RF circuits: Potentials and issues
Author
Akira Matsuzawa ; Abidi, Asad A. ; Bogdan, Staszewski ; Craninckx, Jan ; Dawson, Joel L. ; Tai-Cheng Lee ; Murmann, Boris ; Bang Sup Song
Author_Institution
Tokyo Institute of Technology, Japan
fYear
2008
fDate
3-5 Nov. 2008
Firstpage
485
Lastpage
485
Abstract
Resent analog and RF circuits are increasing performance assisted by digital technology. This panel will demonstrate the potentials of this technology and discuss residual issues and potential solutions. Unlike conventional panels, this panel will not discuss explicit controversy such as A or B. The aim of this panel is to show recent new technology trend and to come out the real issues and potential solutions like tutorial session. Each panelist demonstrates the feature of digitally assisted analog and RF circuits followed by showing some residual issues in about 10 min and discuss the real issues and solutions with audiences.
Keywords
Chip scale packaging; Circuits; National electric code; Radio frequency; Silicon; Stacking; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
Conference_Location
Fukuoka, Japan
Print_ISBN
978-1-4244-2604-1
Electronic_ISBN
978-1-4244-2605-8
Type
conf
DOI
10.1109/ASSCC.2008.4708833
Filename
4708833
Link To Document