• DocumentCode
    1834740
  • Title

    Comparison among different via models based on Feature Selective Validation technique

  • Author

    Pan, Siming ; Wang, Hanfeng ; Fan, Jun

  • Author_Institution
    UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO, USA
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    264
  • Lastpage
    267
  • Abstract
    A new approach is proposed in this paper to validate different uncertain approaches without knowing a standard reference by applying the feature selective validation (FSV) technique. New reference is established by the weighted average of the various approaches. Four via modeling methods including physics-based circuit model, equivalent transmission line model, multiple scattering model, and full wave model are compared and validated by the approach proposed in this paper to illustrate the effectiveness of different via modeling techniques.
  • Keywords
    equivalent circuits; microassembling; printed circuits; transmission lines; equivalent transmission line model; feature selective validation technique; full wave model; multiple scattering model; physics-based circuit model; via modeling methods; Circuit simulation; Computational electromagnetics; Computational modeling; Distributed parameter circuits; Electromagnetic compatibility; Electromagnetic modeling; Electromagnetic scattering; Laboratories; Power transmission lines; Printed circuits; Feature selective validation (FSV); equivalent transmission line model; full wave model; multiple scattering model; physics-based circuit model; via modeling; weighted average;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284669
  • Filename
    5284669