Title :
Comparison among different via models based on Feature Selective Validation technique
Author :
Pan, Siming ; Wang, Hanfeng ; Fan, Jun
Author_Institution :
UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol. (formerly Univ. of Missouri-Rolla), Rolla, MO, USA
Abstract :
A new approach is proposed in this paper to validate different uncertain approaches without knowing a standard reference by applying the feature selective validation (FSV) technique. New reference is established by the weighted average of the various approaches. Four via modeling methods including physics-based circuit model, equivalent transmission line model, multiple scattering model, and full wave model are compared and validated by the approach proposed in this paper to illustrate the effectiveness of different via modeling techniques.
Keywords :
equivalent circuits; microassembling; printed circuits; transmission lines; equivalent transmission line model; feature selective validation technique; full wave model; multiple scattering model; physics-based circuit model; via modeling methods; Circuit simulation; Computational electromagnetics; Computational modeling; Distributed parameter circuits; Electromagnetic compatibility; Electromagnetic modeling; Electromagnetic scattering; Laboratories; Power transmission lines; Printed circuits; Feature selective validation (FSV); equivalent transmission line model; full wave model; multiple scattering model; physics-based circuit model; via modeling; weighted average;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284669