• DocumentCode
    1834756
  • Title

    A GHz common-mode filter using negative permittivity metamaterial on low temperature co-fire ceramic (LTCC) substrate

  • Author

    Tsai, Chung-Hao ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ. (NTU), Taipei, Taiwan
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    A broadband common-mode noise suppression filter for GHz differential signals is proposed using effective negative permittivity transmission line metamaterial. The proposed structure possesses a complete ground plane for the use of the multilayer structure. The equivalent circuit models for odd mode and even mode are developed to derive the dispersion relation and understand the characteristic of common-mode suppression. A practical configuration with 4 cells is designed based on the Low-Temperature Co-Fire Ceramic (LTCC) fabrication technology. It is found the common mode noise can be reduced by the structure over 10 dB from 3.8 GHz to 7.1 GHz (FBW = 60 %) and over 50% of amplitude in time domain. The differential signal integrity in terms of insertion loss and transmission phase still shows a good quality in the proposed filter.
  • Keywords
    digital filters; equivalent circuits; metamaterials; noise; permittivity; transmission lines; broadband common-mode noise suppression filter; differential signal integrity; dispersion relation; effective negative permittivity transmission line metamaterial; equivalent circuit models; insertion loss; low temperature cofire ceramic substrate; multilayer structure; transmission phase; Ceramics; Circuit noise; Dispersion; Distributed parameter circuits; Equivalent circuits; Filters; Land surface temperature; Metamaterials; Nonhomogeneous media; Permittivity; EMI; Negative permittivity; common-mode filter; differential signal; differential transmission line; metamaterial; signal integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284670
  • Filename
    5284670