DocumentCode
1834770
Title
A Microstrip Fixture Design for Power GaAs Fets
Author
Lane, Richard Q.
Author_Institution
California Eastern Laboratories
Volume
15
fYear
1989
fDate
15-16 June 1989
Firstpage
9
Lastpage
16
Abstract
Small signal,(low power) devices can very adequately be In the new microstrip design the chip is die attached directly to a gold plated copper or brass carrier which is in intimate thermal contact with a finned aluminum heat sink. This results in an "unblown" thermal resistance of 3.S??C/Watt and a "blown" Rth of 1,6OC/Watt.
Keywords
Calibration; Coplanar waveguides; FETs; Fixtures; Gallium arsenide; Heat sinks; Microstrip; Power measurement; Semiconductor device measurement; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
ARFTG Conference Digest-Spring, 33rd
Conference_Location
Long Beach, CA, USA
Print_ISBN
0-7803-5686-1
Type
conf
DOI
10.1109/ARFTG.1989.323933
Filename
4119499
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