Title :
Parameterized models for crosstalk analysis in high-speed interconnects
Author :
Ferranti, Francesco ; Dhaene, Tom ; Knockaert, Luc ; Antonini, Giulio
Author_Institution :
Dept. of Inf. Technol. (INTEC), Ghent Univ., Ghent, Belgium
Abstract :
We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines (MTLs), that is suitable to interconnect modeling. It is based on a recently introduced spectral approach for the analysis of lossy and dispersive MTLs extended by utilizing the Multivariate Orthonormal Vector Fitting (MOVF) technique to build parametric macromodels in a rational form. They can handle design parameters, such as substrate or geometrical layout features, in addition to frequency. The presented technique is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICE-like solvers. Parametric macromodels allow to carry out design space exploration, design optimization and crosstalk analysis efficiently. A numerical example validates the proposed approach in both frequency and time domain and is focused on the crosstalk analysis.
Keywords :
crosstalk; multiconductor transmission lines; network synthesis; vectors; SPICE-like solvers; crosstalk analysis; design optimization; design parameters; design space exploration; dispersive multiconductor transmission lines; equivalent circuits; frequency domain; high-speed interconnects; lossy multiconductor transmission lines; multivariate orthonormal vector fitting; parameterized models; parametric macromodeling technique; state-space models; time domain; Circuit synthesis; Crosstalk; Dispersion; Equivalent circuits; Fitting; Frequency; Integrated circuit interconnections; Multiconductor transmission lines; Propagation losses; Space exploration;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284676