DocumentCode :
1834915
Title :
Miniaturized folded substrate integrated waveguide filters in LTCC
Author :
Fei, Yang ; Rui-zhu, Liu ; Hong-xi, Yu ; Xin-yang, He ; Ying, Zhou
Author_Institution :
China Acad. of Space Technol. (Xi´´an), Xi´´an, China
fYear :
2011
fDate :
22-25 May 2011
Firstpage :
171
Lastpage :
173
Abstract :
This paper proposes miniaturized band-pass filters with folded substrate integrated waveguide (FSIW) resonators using multilayer low-temperature co-fired ceramic (LTCC) technology. The FSIW resonator is used for the circuit size reduction with its footprint about a half of the conventional TE101 mode. With LTCC technology, it is more flexibility to organize the cavities of filters because of the 3-D arrangement. The vertically stacked cavities are coupled by slots, which can implement different coupling signs with different locations. A new useful topology of FSIW filter is then proposed. Two Ku-band three-order band-pass filters with different transfer responses, Chebyshev and elliptic, are given and verified by experiments. A good agreement between the simulated and measured results is observed, which has also validated the proposed concept of design with the FSIW technology.
Keywords :
band-pass filters; ceramics; resonator filters; substrate integrated waveguides; waveguide filters; 3D arrangement; Chebyshev filter; FSIW filter; FSIW resonator; Ku-band three-order band-pass filters; LTCC; TE101 mode; circuit size reduction; coupling signs; elliptic filter; folded substrate integrated waveguide resonators; miniaturized band-pass filters; miniaturized folded substrate integrated waveguide filters; multilayer low-temperature co-fired ceramic technology; transfer responses; vertically stacked cavities; Band pass filters; Cavity resonators; Chebyshev approximation; Couplings; Filtering theory; Microwave filters; Resonator filters; FSIW; LTCC; filter;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Technology & Computational Electromagnetics (ICMTCE), 2011 IEEE International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-8556-7
Type :
conf
DOI :
10.1109/ICMTCE.2011.5915192
Filename :
5915192
Link To Document :
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