• DocumentCode
    1835040
  • Title

    Five-pole LTCC cavity filter for wireless applications at 34GHz

  • Author

    Yuan, Bo ; Mou, Jinchao ; Yu, Weihua ; Lv, Xin

  • Author_Institution
    Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
  • fYear
    2011
  • fDate
    22-25 May 2011
  • Firstpage
    193
  • Lastpage
    195
  • Abstract
    System-on-Package (SOP) is presently the most effective method for realizing the miniaturization of wireless front-end applications. Band pass filter is one of the most important components in the SOP. In this paper, a 5-pole band pass cavity filter consisting of via walls was designed as a system-on-package solution for RF front-end modules at 34GHz, adopting low-temperature co-fired ceramics (LTCC). The BPF is vertically made up of five cavity resonators with via walls and has been simulated and optimized by Ansoft HFSS. This filter which has been realized in a seven layers ceramic substrate exhibits an insertion loss of 0.89 dB at the center frequency of 34 GHz, a rejection <;37.5 dB(32.9GHz and 35.8GHZ), and 3dB bandwidth approximately 4.5%(~ 1.5 GHz). Due to its vertical structure, this filter shows promising application potentials in miniaturized SOP.
  • Keywords
    band-pass filters; cavity resonators; ceramics; millimetre wave filters; system-on-package; Ansoft HFSS; RF front-end modules; band pass filter; cavity resonators; five-pole LTCC cavity filter; frequency 1.5 GHz; frequency 32.9 GHz; frequency 34 GHz; frequency 35.8 GHz; loss 0.89 dB; low-temperature co-fired ceramics; system-on-package; wireless front-end; Band pass filters; Cavity resonators; Filtering theory; Microwave filters; Radio frequency; Resonant frequency; Resonator filters; Band Pass Filter (BPF); Low-Temperature Co-fired Ceramics (LTTC); System-on-Package (SOP); miniaturization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Technology & Computational Electromagnetics (ICMTCE), 2011 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-8556-7
  • Type

    conf

  • DOI
    10.1109/ICMTCE.2011.5915199
  • Filename
    5915199