Title :
An investigation of the effect of grounding pads on power bus resonance characteristics
Author :
Morishita, Ken ; Hubing, Todd ; He, Xinbo ; Kobayashi, Naoki ; Harada, Takashi
Author_Institution :
Syst. Jisso Res. Labs., NEC, Kawasaki, Japan
Abstract :
This paper describes the effect of grounding pads on power bus resonance characteristics in multilayer printed circuit boards (PCBs). The resonance characteristics of a four-layer PCB with and without grounding pads are investigated by full-wave simulation. The results show that the presence of the grounding pads shifts the resonant frequencies significantly lower. The grounding pads can be modeled as a series LCR circuit for SPICE simulation. Using the SPICE model, the effect of the locations of the grounding pads on the resonance characteristics is investigated.
Keywords :
SPICE; circuit resonance; circuit simulation; earthing; printed circuit design; LCR circuit; SPICE simulation; full-wave simulation; grounding pad; multilayer printed circuit board; power bus resonance; resonant frequency; Circuit simulation; Circuit testing; Conductors; Fasteners; Grounding; Laboratories; Nonhomogeneous media; Printed circuits; Resonance; SPICE;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284693
