Title :
On the coupling between the signal layers and the power-bus on multilayered PCBs
Author :
Heinrich, Gerd ; Dickmann, Stefan
Author_Institution :
Fac. of Electr. Eng., Helmut Schmidt Univ., Hamburg, Germany
Abstract :
In this paper, lumped models are used to describe the effects of vias in multilayered PCBs. Possible effects of a via on a 4-layer PCB are explained and investigated: the coupling between the via and the power-bus, and the influence on the signal propagation at the via transition. In addition, a computation procedure using lumped models for PCBs with more than 4 layers is presented and some special effects on a via are explained. Finally, another possible coupling mechanism, the direct coupling of the waveguide modes from the power-bus into a stripline is investigated.
Keywords :
coupled circuits; multilayers; printed circuit design; coupling; lumped models; multilayered PCB; power-bus; signal layers; signal propagation; waveguide modes; Character generation; Frequency; Geometry; Impedance; Joining processes; Microstrip; Solid modeling; Stripline components; Voltage; Waveguide components;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284696
