• DocumentCode
    1835949
  • Title

    Finding minimum interconnect sub-arrays in reconfigurable VLSI arrays

  • Author

    Jigang, Wu ; Srikanthan, Thambipillai ; Wang, Kai

  • Author_Institution
    Centre for High Performance Embedded Syst., Nanyang Technol. Univ., Singapore
  • fYear
    2008
  • fDate
    18-21 May 2008
  • Firstpage
    1352
  • Lastpage
    1355
  • Abstract
    Shorter total interconnect and fewer switches in a VLSI array definitely lead to less capacitance, power dissipation and dynamic communication cost between the processing elements (PEs). This paper presents techniques to find a logical (target) array that has shorter interconnect and fewer switches in a reconfigurable VLSI array with faulty PEs. The proposed algorithm initially searches for a sub-array on the host array, which contains the minimum number of the faults. Then it reroutes the sub-array, rather than the whole host array as was done in previous algorithm, to an approximate target array whose size is less then but close to the size of the target array. Finally, the target array is obtained by simple extension of the approximate target array. Experimental results show that the proposed algorithm can construct a target array with much shorter total interconnect. The improvement over the previous work is up to 68% in terms of the interconnect redundancy for the case of the cluster faults.
  • Keywords
    VLSI; integrated circuit interconnections; switches; dynamic communication cost; interconnect redundancy; interconnect sub-arrays; logical array; power dissipation; reconfigurable VLSI arrays; shorter total interconnect; switches; target array; Capacitance; Clustering algorithms; Communication switching; Costs; Degradation; Logic arrays; Power dissipation; Power system interconnection; Switches; Very large scale integration; VLSI array; algorithm; reconfigurable; rerouting;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2008. ISCAS 2008. IEEE International Symposium on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4244-1683-7
  • Electronic_ISBN
    978-1-4244-1684-4
  • Type

    conf

  • DOI
    10.1109/ISCAS.2008.4541677
  • Filename
    4541677