DocumentCode
1836012
Title
Adaptive polygon simplification basing on Delaunay triangulation and its application in high speed PCBs and IC packages simulation
Author
Tang, Zhanghong ; Zhu, Jun ; He, Fei ; Feng, Linwei ; Yang, Guohua ; Han, Guanghui
Author_Institution
Coll. of Mater. Sci. & Eng., Beijing Univ. of Technol., Beijing, China
fYear
2011
fDate
22-25 May 2011
Firstpage
253
Lastpage
256
Abstract
As modern high speed Package Circuit Boards (PCBs) and Integrated Circuit (IC) packages become more and more complicated, the electromagnetic simulation inside the PCBs and IC packages becomes more and more difficult. The most challenge work is that complicated multiple layer shapes inside PCBs and IC packages need very huge amount of high quality meshes for electromagnetic simulation, which lead to huge memory requirement for solving the linear matrix. For most personal computers, that requirement usually lead to out of memory in matrix solution. To overcome this problem without losing the simulation precision, this article presents an algorithm to simplify complex 2-D polygons based on Delaunay triangulation. By checking the smallest angles of triangles which contain an edge of the polygons, the algorithm simplifies polygons adaptively and updates the simplified polygons´ Delaunay triangulation. Different from other simplifications which try to decrease the count of vertices, this algorithm tries to delete redundant short edges, leading to greatly reduced mesh points during the process of generating the constrained and quality Delaunay triangulation. The algorithm presented here has been applied for mesh generation for finite-element analysis of complicated PCBs and IC packages. Test results show that the proposed algorithm can reduce more than 75% in total nodes in comparison with the approach without simplification, resulting in significant reduction of computer resources in numerical computation.
Keywords
integrated circuit packaging; mesh generation; printed circuits; 2-D polygons; Delaunay triangulation; IC package simulation; adaptive polygon simplification; electromagnetic simulation; finite-element analysis; high speed PCB; integrated circuit packages; linear matrix; Adaptation model; Finite element methods; Integrated circuit modeling; Layout; Metals; Shape; Adaptive Polygon Simplification; Delaunay Triangulation; Finite Element Method; High Speed PCBs and IC Packages;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Technology & Computational Electromagnetics (ICMTCE), 2011 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-8556-7
Type
conf
DOI
10.1109/ICMTCE.2011.5915504
Filename
5915504
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