Title :
Signal and power integrity analysis of TSV-Based 3D IC
Author :
Pak, Jun So ; Kim, Heegon ; Cho, Jonghyun ; Kim, Joohee ; Kim, Kiyeong ; Lee, Junho ; Lee, Hyungdong ; Park, Kunwoo ; Kim, Joungho
Author_Institution :
Dept. of EE, KAIST, Daejeon, South Korea
Abstract :
In the paper, an analytical TSV model based on the MIS (Metal-Insulator-Silicon) structure analysis, TSV´s electrical performances and their frequency- and time-domain analysis in viewpoint of transmission line, and on-chip PDN impedance analysis depending on on-chip PDN design including TSV arrangements and stacking configurations of 3D IC are addressed.
Keywords :
MIS structures; frequency-domain analysis; three-dimensional integrated circuits; time-domain analysis; transmission lines; TSV-based 3D IC; frequency-domain analysis; metal-insulator-silicon structure analysis; on-chip PDN impedance analysis; power integrity analysis; signal integrity; stacking configurations; through silicon vias; time-domain analysis; transmission line; Capacitance; Impedance; Silicon; System-on-a-chip; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Electromagnetics in Advanced Applications (ICEAA), 2011 International Conference on
Conference_Location :
Torino
Print_ISBN :
978-1-61284-976-8
DOI :
10.1109/ICEAA.2011.6046280
