DocumentCode :
1836176
Title :
Optimization of boron doped polysilicon resistors
Author :
Lee, Kyungho ; Kang, Hyunsoon ; Jang, Yungsoo ; Lim, Soonkwon
Author_Institution :
Semicond. Res. & Dev. Center, Samsung Electron. Co. Ltd., Kyunggi-Do, South Korea
fYear :
1995
fDate :
24-28 Oct 1995
Firstpage :
659
Lastpage :
661
Abstract :
This paper is concerned with an optimized process of boron doped polysilicon resistors. First, we propose process conditions that make grain size bigger in order to minimize the ratio of grain boundary that results in the variation of polysilicon resistance. Second, we propose process conditions that sustain safe structure at continuous heat treatment processes, electrical and temperature characteristics
Keywords :
boron; elemental semiconductors; grain boundaries; grain size; heat treatment; resistors; semiconductor doping; silicon; Si:B; boron doped polysilicon resistor; electrical characteristics; grain boundary; grain size; heat treatment; process optimization; resistance; temperature characteristics; Boron; Electric resistance; Grain boundaries; Grain size; Heat treatment; Research and development; Resistance heating; Resistors; Semiconductor process modeling; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location :
Beijing
Print_ISBN :
0-7803-3062-5
Type :
conf
DOI :
10.1109/ICSICT.1995.503382
Filename :
503382
Link To Document :
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