• DocumentCode
    18372
  • Title

    Performance Dependence on Width-to-Length Ratio of Si Cap/SiGe Channel MOSFETs

  • Author

    Wen-Teng Chang ; Yu-Seng Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan
  • Volume
    60
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    3663
  • Lastpage
    3668
  • Abstract
    This paper measures the n- and p-MOSFETs fabricated through 65-nm high- k/metal gate CMOSFET process flow. The [110] channels of the Si cap on SiGe with different width (W) and length (L) ratios were compared with Si-only channels. The results show that a high W-L ratio in the [110] n-channel can alleviate the degradation of biaxial compressive stress. Meanwhile, a low W-L ratio in the p-channel can improve the performance; however, the ratio should at least be below two in this paper. The dominance of the longitudinal or transverse configurations successfully explains this phenomenon because of the reliance of the different levels of piezoresistance coefficient on the channel orientation. The threshold voltage shifts versus the W-L ratio in the p-channel is in agreement with the result. The result is verified by a quantitative current comparison at a high bias in the n-/p-channels between the strained SiGe and Si-only channels, which shows that an extreme W-L ratio in the original biaxially strained SiGe channel can result in longitudinal or transverse strain, thereby leading to different levels of performance degradation/improvement.
  • Keywords
    CMOS integrated circuits; Ge-Si alloys; MOSFET; elemental semiconductors; internal stresses; piezoresistance; semiconductor materials; silicon; Si cap/SiGe channel MOSFET; Si-SiGe; [110] channels; biaxial compressive stress; channel orientation; high-k/metal gate CMOSFET process flow; longitudinal configurations; longitudinal strain; n-MOSFET; p-MOSFET; performance dependence; piezoresistance coefficient; size 65 nm; threshold voltage; transverse configurations; transverse strain; width-to-length ratio; Degradation; MOSFET; Piezoresistance; Silicon; Silicon germanium; Strain; Stress; MOSFET; piezoresistance coefficient; strained SiGe; threshold voltage; transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2281397
  • Filename
    6605597