Challenges in packaging a 4 chip FC MCM-L using KGD

Author

Adamjee, Waseem ; Corona, Christina ; Czamowski, J.M. ; Eklund, Rick ; Guajardo, James ; Hedges, D. ; Youngblood, Alvin

Author_Institution

Semicond. Products Sector, Motorola Inc., Austin, TX, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

454

Lastpage

457

Abstract

The FC MCM-L (Flip Chip MultiChip Module on Laminate) product is comprised of four Known Good Die (KGD) on 25×25 mm laminate substrate with solder clad bond pads. The FC MCM-L package was similar to that of single chip flip chip on laminate product with respect to assembly processing and material set. However, differences related to KGD, and the close proximity of die with minimal substrate real estate provided opportunities for process improvement. This paper describes the manufacturing processes and challenges encountered in the chip attach and underfill encapsulation processes. Finally, the MCM test and reliability results are discussed

Keywords

circuit reliability; encapsulation; flip-chip devices; integrated circuit manufacture; microassembling; multichip modules; 25 mm; KGD; MCM reliability; MCM test; assembly processing; chip attach; flip chip MCM-L; four chip MCM; known good die; laminate substrate; manufacturing processes; packaging; solder clad bond pads; underfill encapsulation processes; Assembly; Bonding; Corona; Encapsulation; Flip chip; Laminates; Manufacturing processes; Semiconductor device packaging; Substrates; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678733

Filename

678733