Overmold technology applied to cavity down ultrafine pitch PBGA package

Author

Ouimet, Sylvain ; Paquet, Marie-Claude

Author_Institution

IBM Canada Ltd., Bromont, Que., Canada

fYear

1998

fDate

25-28 May 1998

Firstpage

458

Lastpage

462

Abstract

The transfer molding technology is normally used for leadframe type packages and chip-up PBGA (Plastic Ball Grid Array) packages. This technology has been applied to cavity down PBGA packages where, normally, a liquid epoxy is dispensed by a needle in the cavity in order to cover the device and gold wires without exceeding the solder ball height plane. The new encapsulation approach using transfer molding process as well as the debug/qualification method and results using an ultrafine pitch wirebond PBGA process are described

Keywords

encapsulation; fine-pitch technology; integrated circuit manufacture; integrated circuit packaging; plastic packaging; Au; ball grid array; cavity down PBGA package; debug/qualification method; encapsulation; gold wires; liquid epoxy dispensing; overmold technology; plastic BGA package; ultrafine pitch PBGA package; ultrafine pitch wirebond process; Electronics packaging; Encapsulation; Gold; Integrated circuit interconnections; Laminates; Lead; Plastic packaging; Printed circuits; Transfer molding; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678734

Filename

678734