Agile fab concepts for cost effective and QTAT mini fab

Recently SoC devices require QTAT and low cost. Also SoC device quickly change its design so that total production amount is not so many. In this situation we propose the Agile fab to solve these problems. The basic concept of the Agile fab consists of following three ideas; (i) Small size Jab supported by virtual Jab, (ii) Multi-task and multi-functional tools, (iii) Minimization and smoothing of RPT (Raw Process Time). WIP control is important for maximum production and minimized X-factor. Multi-functional and multi-task tools make it possible to reduce the excess capacity and the excess investment. Those tools are furnace, dry etching, wet cleaning, stencil ion implantation. Reduction of RPT is achieved by the sequential process, stencil mask ion implantation process, scan-coating for insulating layers and new electro-plating process. The total RPT is reduced less than a half of conventional case. The tool numbers can be reduced to about a half using the multi-functional, multi-task tools and minimization of RPT