Unified tool communication specification for 300 mm automated fab

Author

Kono, Satoshi ; Masui, Tomoydu ; Ohyama, Yasushi

Author_Institution

Fujitsu Ltd., Tokyo, Japan

fYear

2001

fDate

2001

Firstpage

19

Lastpage

22

Abstract

In 300 mm diameter wafer fabrication line, concrete infrastructure that enables high degree of line operation is essential to minimize the cost and the risk of new 300 mm fab infrastructure and integration. Equipment online communication is an essential technology as fab infrastructure. Based on CIM-GJG and SEMI standards, Selete (Semiconductor Leading Edge Technologies, Inc.) has been developed unified process tool communication specification and its test specification at implementation level. These specifications will be used as base specifications among device makers and give directions of design and implementation at equipment suppliers

Keywords

computer aided production planning; computer integrated manufacturing; integrated circuit economics; integrated circuit yield; open systems; production control; 300 mm; CIM capability; CIM-GJG standards; SEMI standards; carrier transfer system; cost saving; equipment online communication; extended functionality; fab infrastructure; high productivity; implementation level; interoperability; test specification; unified process tool communication specification; wafer fabrication line; Automatic control; Communication standards; Concrete; Costs; Fabrication; Lead compounds; Productivity; Semiconductor device testing; Standardization; Standards development;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.962905

Filename

962905