Assembly-level reliability characterization of chip-scale packages

Author

Lall, Pradeep ; Banerji, Kingshuk

Author_Institution

Adv. Manuf. Technol. Center, Motorola, Plantation, FL, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

482

Lastpage

494

Abstract

The reliability of the Elastomer-on-Flex Interposer Chip-Scale Package has been studied under thermal fatigue, out-of-plane deformation, humidity and thermal aging. Two versions of the Elastomer-on-Flex Interposer CSP (from a single source) have been characterized in this study-the 48-pin and 40-pin. Both the 40-bump and 48-bump versions have ball 0.3 mm (11.81 mils) in diameter solder balls at 0.75 mm pitch. Non-linear finite element models have been used to identify and predict the dominant failure mechanisms. The model predictions have been verified with accelerated test data. The results for all the dominant failure mechanisms have been bench-marked against existing technologies including overmolded PBGAs and rigid substrate flip-chip BGAs

Keywords

ageing; deformation; failure analysis; finite element analysis; humidity; integrated circuit packaging; integrated circuit reliability; lead bonding; life testing; microassembling; thermal stress cracking; 0.3 mm; 0.75 mm; 40-pin type; 48-pin type; BGA format package; FEM; accelerated test data; assembly-level reliability characterization; chip-scale packages; dominant failure mechanisms; elastomer-on-flex interposer CSP; humidity; model predictions; nonlinear finite element models; out-of-plane deformation; thermal aging; thermal fatigue; Aging; Assembly; Chip scale packaging; Failure analysis; Fatigue; Finite element methods; Humidity; Life estimation; Predictive models; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678738

Filename

678738