• DocumentCode
    1838141
  • Title

    Accurate Modelling of MHMIC Passive Elements Yields a Successful Design and Packaging of a 20 GHz to 5 GHZ MHMIC Low-Noise Downconverter

  • Author

    Fikart, J.L. ; Fairbum, M. ; Minkus, E. ; Kwan, Francis

  • Author_Institution
    MPR Teltech Ltd., Burnaby, B.C., Canada
  • Volume
    22
  • fYear
    1992
  • fDate
    3-4 Dec. 1992
  • Firstpage
    41
  • Lastpage
    49
  • Abstract
    The MHMIC circuits described in this paper have been designed as part of a general technology development program, with some of them subsequently refined for specific applications. One example of this was a downconverter for portable transceivers operating at 20 GHz. The intended outdoor application imposed size restrictions and required that the units operate over a large temperature range. High reliability was also required. Furthermore, low noise and high gain with a very flat frequency response were dictated by overall system considerations. The focus of this paper is not the converter subsystem as such but rather the rationale behind the selection of a circuit technology suitable for applications like this and the corresponding design, modelling, packaging and, in particular, characterization and testing using techniques adaptable to automation.
  • Keywords
    Bonding; Circuit noise; Circuit testing; Dielectric thin films; Gallium arsenide; MMICs; Microwave integrated circuits; Packaging; Thin film circuits; Thin film inductors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Fall, 40th
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1992.326998
  • Filename
    4119656