• DocumentCode
    1838166
  • Title

    A new low dielectric constant siloxane polymer: AccuspinR T-24

  • Author

    Hacker, Nigel P. ; Figge, Lisa K. ; Flores, Veronica ; Lefferts, Scott P.

  • Author_Institution
    AlliedSignal Adv. Microelectron. Mater., Sunnyvale, CA, USA
  • fYear
    1998
  • fDate
    1-3 Jun 1998
  • Firstpage
    286
  • Lastpage
    288
  • Abstract
    A new spin-on-polymer with excellent physical and mechanical properties is described. AccuspinR T-24 is a siloxane based polymer which has a dielectric constant of 2.5 after cure, the lowest reported for this class of materials. In addition, thick, crack-free films can be prepared which exhibit excellent planarization and gap-fill and are suitable for both subtractive aluminum and damascene processes
  • Keywords
    dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; permittivity; polymer films; spin coating; surface treatment; Accuspin T-24 siloxane polymer; Al; crack-free films; curing; damascene processes; dielectric constant; gap-fill; mechanical properties; physical properties; planarization; siloxane polymer; spin-on-polymer; subtractive aluminum processes; Curing; Dielectric constant; Dielectric materials; Hydrogen; Inorganic materials; Optical films; Polymer films; Stress; Temperature; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-4285-2
  • Type

    conf

  • DOI
    10.1109/IITC.1998.704925
  • Filename
    704925
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1838166