Author :
Kniffin, S.D. ; McCabe, J.F. ; Gardner, G.A. ; Lintz, J. ; Ross, C. ; Golke, K. ; Bums, B. ; Sanders, A.B. ; Reed, R.A. ; LaBel, K.A. ; Marshall, P.W. ; Liu, S.T. ; Kim, H.S. ; Forney, J.D. ; Tabbert, C.J. ; Carts, M.A. ; Swonger, J.W.
Author_Institution :
Orbital Sci. Corp., Dulles, VA, USA
Keywords :
integrated circuit design; integrated circuit testing; proton effects; radiation hardening (electronics); silicon-on-insulator; RHBD best practices; SEU angular effects; SEU rate; SOI devices; SOS devices; Si-Al/sub 2/O/sub 3/; Si-SiO/sub 2/; proton angle of incidence; proton-induced single-event upsets; radiation hardening by design; silicon-on-insulator; silicon-on-sapphire; Clocks; Extraterrestrial measurements; Manufacturing processes; NASA; Particle beams; Protons; Random access memory; Silicon on insulator technology; Single event upset; Testing;