Title :
Lithography-less ion implantation technology for agile fab
Author :
Shibata, T. ; Sugoruo, K. ; Sughihara, K. ; Okumura, K. ; Nishihashi, T. ; Kashimoto, K. ; Fujiyama, J. ; Sakurada, Y. ; Gorou, T. ; Saji, N. ; Tsunoda, M.
Author_Institution :
Semicond. Co., Toshiba Corp., Kanagawa, Japan
Abstract :
A new type of ion implanter developed for an agile fab can eliminate the processes concerned with photo resist lithography from the ion implantation process. This new ion implantation technology can reduce the row process time, footprint, and the cost of ownership to less than 1/2 that of conventional ion implantation technology. We are making further developments on this ion implanter and evaluating technical issues related to ion implantation, a technique suitable for manufacturing submicron IC devices. Based on the results of evaluating the prototype machine, we will produce the next β-machine
Keywords :
integrated circuit manufacture; integrated circuit technology; ion implantation; IC manufacture; IC production; agile jab; cost of ownership reduction; footprint reduction; ion implanter; lithography-less ion implantation technology; row process time reduction; stencil mask; submicron IC devices; Agile manufacturing; Biomembranes; Costs; Electrostatics; Implants; Ion implantation; Lithography; Resists; Semiconductor device manufacture; Semiconductor devices;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962927
