Wafer ambient control for Agile FAB

Author

Ito, Shoko ; Tamaoki, Makiko ; Shimazaki, Ayako ; Nadahara, Soichi ; Okumura, Katsuya ; Suzuki, Yoko ; Tanaka, Akira ; Tsujimura, Manabu

Author_Institution

Semicond. Co., Toshiba Corp., Yokohama, Japan

fYear

2001

fDate

2001

Firstpage

121

Lastpage

124

Abstract

The "Wafer Ambient Control Box" has been developed for minimizing the influence of chemical contaminants such as acidic gas, basic gas, organic molecules, and also humidity. It consists of a ULPA filter, chemical filters, SPE films (dehumidifier), and a fan. We applied the Box to the Al interconnection process. The acidic gas adsorbed on the wafer causes corrosion defects. By keeping the wafer in the "Wafer Ambient Control Box", Al lines were prevented from corrosion because the chemical filter trapped the acidic gas desorbed from the wafer. We also applied the humidity controlled one to the poly-Si plug process. The poly-Si/Si contact resistance was equivalent to that processed continuously even though it was kept for 67 h before poly-Si deposition

Keywords

aluminium; filtration; flexible manufacturing systems; humidity control; impurities; integrated circuit interconnections; integrated circuit manufacture; surface contamination; Agile FAB; Al; Al interconnection process; SPE films; Si; ULPA filter; acidic gas; chemical contaminants; chemical filters; corrosion prevention; dehumidifier; fan; flexible manufacturing system; humidity; organic molecules; poly-Si plug process; poly-Si/Si contact resistance; wafer ambient control box; wafer surface; Air cleaners; Chemical processes; Contamination; Corrosion; Costs; Filters; Humidity control; Organic chemicals; Oxidation; Semiconductor films;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.962929

Filename

962929