Low cost/high volume laser modules using silicon optical bench technology

Reports on the use of SiOB technology used in the production of low cost/high volume, reliable edge emitting laser modules. The SiOB platform is designed for manufacturability, reduced parts count, reduced process steps, and ability to accept design changes to respond to a rapidly changing marketplace. For example, this SiOB technology has been used for at least four different laser designs/types without significant changes in the process. The SiOB technology is the first of its kind in that it integrates: i) silicon micromachining for the lens holder cavities and back face monitor turning mirror, ii) Ti/Pt/Au for interconnect metalization, photodiode bonding, and turning mirror iii) aluminum for AlO bonding attachment of the lens, and iv) Au/Sn solder for laser attachment. The laser and photodiode are passively aligned using a visual alignment system and fiducials on the silicon. The lens is self-aligned to the silicon during the AlO bonding process