Control of edge polishing profile with air float carrier

Author

Fujita, Takashi ; Touzov, Mikhail ; Michiya, Satomi ; Doy, T.K.

Author_Institution

CMP Group, Tokyo Seimitsu Co. Ltd., Japan

fYear

2001

fDate

2001

Firstpage

183

Lastpage

186

Abstract

An air float carrier is developed to achieve uniform polishing with continuous air supply during polishing of the wafer. The carrier has a thin support film inside the retainer ring. Retainer pressure enables the support film to push the wafer edge down to the pad locally to control edge-polishing profile. Using this air float carrier, we try to evaluate the relationship between pressure profile measured under static condition and actual edge-polishing profile at various retainer extensions and various retainer pressures. As a result of this comparison, it has become evident that the calculated pressure profile corresponds to the actual edge-polishing profile and retainer pressure has a great influence on the actual edge-polishing profile

Keywords

chemical mechanical polishing; integrated circuit measurement; integrated circuit technology; integrated circuit yield; process control; air float carrier; continuous air supply; edge polishing profile; pressure profile; retainer extensions; retainer pressure; static condition; uniform polishing; wafer edge; Area measurement; Chemical processes; Continuing education; Finite element methods; Manufacturing processes; Pressure control; Pressure measurement; Semiconductor device manufacture; Semiconductor device modeling; Stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Symposium, 2001 IEEE International

Conference_Location

San Jose, CA

Print_ISBN

0-7803-6731-6

Type

conf

DOI

10.1109/ISSM.2001.962944

Filename

962944