Education project for the development of curricula, research and prototyping facilities in the field of electronics interconnection and packaging

Author

Illyefalvi-Vitéz, Zsolt ; Harsányi, Gábor ; Németh, Pál ; Pinkola, János

Author_Institution

Dept. of Electron. Technol., Tech. Univ. Budapest, Hungary

fYear

1998

fDate

25-28 May 1998

Firstpage

657

Lastpage

662

Abstract

The preparation of electronics engineers for the 21st century´s requirements in the field of microelectronics interconnection and packaging is a real challenge for today´s education. An approach that provides appropriate lecture courses and practical experiments, initiates students into research projects, and teaches technology in a real prototype manufacturing environment, can hopefully achieve the main goals. A project for the development of the education has been started

Keywords

educational courses; electronic engineering education; electronic equipment manufacture; integrated circuit technology; packaging; education project; electronics engineers; electronics interconnection; electronics packaging; lecture courses; microelectronics interconnection; prototype manufacturing environment; prototyping facilities; research; research projects; Computer aided manufacturing; Computer integrated manufacturing; Electronics industry; Electronics packaging; Integrated circuit interconnections; Integrated circuit technology; Materials science and technology; Microelectronics; Prototypes; Thin film sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678767

Filename

678767