A study of high density and reliability BGA package with solder ball lands of oval type

Author

Kim, S.J. ; Lee, C.H. ; Lee, S.G. ; Syed, A.

Author_Institution

R&D Center, Anam Semicond., Seoul, South Korea

fYear

1998

fDate

25-28 May 1998

Firstpage

680

Lastpage

684

Abstract

In this paper, we propose the solder ball lands of oval type for the laminated substrate design of BGA. With this design concept, the ball shear strength test was performed for the relative comparison between conventional (spherical) type and a proposed oval type. In the case of oval type pad design, the minimum and average value of solder ball shear were increased relative to circular type pad and its standard deviation value was decreased. Additionally, oval type lands can allow the designers to insert at least 50% more traces between adjacent unit-pitched-solder ball lands than conventional design so that better traceability for this small sized packages can be obtained. The simulation result of solder ball fatigue life with BGA package was covered in this paper

Keywords

fatigue; packaging; reliability; shear strength; soldering; BGA package; fatigue life; laminated substrate; oval type land; reliability; shear strength; simulation; solder ball; traceability; Electronic packaging thermal management; Electronics packaging; Lead; Manufacturing; Research and development; Routing; Semiconductor device packaging; Substrates; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678771

Filename

678771