• DocumentCode
    1839047
  • Title

    Ceramic ball grid array for AMD K6 microprocessor application

  • Author

    Master, Raj N. ; Dolbear, Thomas P. ; Cole, Marie S. ; Martin, Gregory B.

  • Author_Institution
    Adv. Micro Devices, AMD, Sunnyvale, CA, USA
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    702
  • Lastpage
    706
  • Abstract
    Reliability of ceramic ball grid arrays has been reported in previous studies. These studies were carried out with respect to the body size and assembly parameters. This paper will report on reliability of a relatively thin package (<1 mm) in a daughter card format. This format is typical of many mobile personal computers. In addition, we will describe the effect of thickness and card pad design on the second level reliability of the ceramic ball grid array. Impact of silicon die and continuous compressive load on reliability will also be described
  • Keywords
    ceramics; integrated circuit packaging; integrated circuit reliability; microprocessor chips; AMD K6 microprocessor; ceramic ball grid array; compressive load; daughter card; mobile personal computer; package; reliability; silicon die; Assembly; Ceramics; Electronics packaging; Fatigue; Microcomputers; Microprocessors; Soldering; Testing; Thermal stresses; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components &amp; Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678775
  • Filename
    678775
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1839047