DocumentCode :
1839073
Title :
Solder joint fatigue life of fleXBGATM assemblies
Author :
Darveaux, Robert ; Mawer, Andrew
Author_Institution :
Amkor Electronics, Chandler, AZ, USA
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
707
Lastpage :
712
Abstract :
fleXBGAuTM is a chip scale package offered by Amkor. The package is based on a flex circuit (tape) substrate, and has a die up, wire bonded, over molded configuration. This paper presents board level reliability data over a wide range of variables. The performance is also compared to μBGATM TSOP packages
Keywords :
fatigue; integrated circuit packaging; integrated circuit reliability; lead bonding; Amkor; board level reliability data; chip scale package; fleXBGA assemblies; flex circuit substrate; over molded configuration; solder joint fatigue life; wire bonded; Apertures; Assembly; Condition monitoring; Failure analysis; Fatigue; Fingers; Packaging; Soldering; Testing; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678776
Filename :
678776
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1839073
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