Title :
Resource conservation of buffered HF in semiconductor manufacturing
Author :
Inagaki, Yasuhito ; Shimizu, Mineo
Author_Institution :
Corporate Environ. Affairs, Sony Corp., Yokohama, Japan
Abstract :
Buffered HF (BHF), which is a mixture of hydrofluoric acid and ammonium fluoride, is used for etching and cleaning silicon wafers. Waste BHF is generally treated with a variety of chemicals, resulting in the discharge of much wastewater and sludge. We have developed a new method to extend the period of BHF can be used by supplying elements which depend on the ratio of NH4F to HF in BHF. This method can reduce the BHF required, reduce the chemicals required to treat waste BHF and decrease the discharge of wastewater and sludge
Keywords :
coagulation; etching; flocculation; recycling; semiconductor technology; surface cleaning; HF; HF-NH4F; buffered HF; cleaning; coagulation; etch rate; etching; flocculation; resource conservation; semiconductor manufacturing; silicon wafers; sludge; usable period; wastewater; Chemicals; Cleaning; Coagulation; Etching; Hafnium; Polymers; Semiconductor device manufacture; Silicon; Sludge treatment; Wastewater treatment;
Conference_Titel :
Semiconductor Manufacturing Symposium, 2001 IEEE International
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-6731-6
DOI :
10.1109/ISSM.2001.962954
