Development of a new solder joint modeling tool for IC package designers

Author

Lewis, Daniel ; Warren, James ; Josell, Daniel

Author_Institution

Lucent Technol., Allentown, PA, USA

fYear

1998

fDate

25-28 May 1998

Firstpage

734

Lastpage

736

Abstract

In an attempt to assist IC package designers, a model for predicting solder meniscus geometries from lead shapes and material parameters is currently under development. Of particular interest, the gull-wing lead is mathematically represented as a horizontal section and two smoothly joined parabolas, allowing close matching of experimental gull-wing solder joints. Solutions are obtained using the public domain Surface Evolver software. This software was designed to solve problems pertaining to equilibrium meniscus geometry and includes routines for calculating wetting forces such as those exerted on component leads by molten solder. Meniscus geometry and force results from these calculations can be used in finite-element modeling programs to determine thermomechanical stresses

Keywords

finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; soldering; thermal stresses; IC package design; Surface Evolver software; finite-element modeling programs; gull-wing lead; horizontal section; lead shapes; material parameters; meniscus geometries; modeling tool; smoothly joined parabolas; solder joint modeling; thermomechanical stresses; wetting forces; Geometry; Integrated circuit modeling; Integrated circuit packaging; Lead; Predictive models; Shape; Software design; Soldering; Solid modeling; Thermal force;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 1998. 48th IEEE

Conference_Location

Seattle, WA

ISSN

0569-5503

Print_ISBN

0-7803-4526-6

Type

conf

DOI

10.1109/ECTC.1998.678781

Filename

678781